HSP150/YJL159W Literature Guide Help

Other names published for HSP150: CCW7, ORE1, PIR2, heat shock protein HSP150, YJL159W

HSP150 - Fungal Related Genes/Proteins (11)

ReferenceOther Genes Addressed
Suntio T, et al.  (2011) ATPase activity of a yeast secretory glycoprotein allows ER exit during inactivation of COPII components Sec24p and Sec13p. Yeast 28(6):453-65
Kovacs M, et al.  (2008) Characterization of Ccw7p cell wall proteins and the encoding genes of Saccharomyces cerevisiae wine yeast strains: relevance for flor formation. FEMS Yeast Res 8(7):1115-26
Coronado JE, et al.  (2007) Conserved processes and lineage-specific proteins in fungal cell wall evolution. Eukaryot Cell 6(12):2269-77
Richard GF and Dujon B  (2006) Molecular evolution of minisatellites in hemiascomycetous yeasts. Mol Biol Evol 23(1):189-202
Weig M, et al.  (2004) Systematic identification in silico of covalently bound cell wall proteins and analysis of protein-polysaccharide linkages of the human pathogen Candida glabrata. Microbiology 150(Pt 10):3129-44
Kandasamy R, et al.  (2000) Evidence for the presence of pir-like proteins in Candida albicans. FEMS Microbiol Lett 186(2):239-43
Kapteyn JC, et al.  (2000) The cell wall architecture of Candida albicans wild-type cells and cell wall-defective mutants. Mol Microbiol 35(3):601-11
Moukadiri I, et al.  (1999) Identification of two mannoproteins released from cell walls of a Saccharomyces cerevisiae mnn1 mnn9 double mutant by reducing agents. J Bacteriol 181(16):4741-5
Mrsa V, et al.  (1997) Specific labelling of cell wall proteins by biotinylation. Identification of four covalently linked O-mannosylated proteins of Saccharomyces cerevisiae. Yeast 13(12):1145-54
Toh-e A, et al.  (1993) Three yeast genes, PIR1, PIR2 and PIR3, containing internal tandem repeats, are related to each other, and PIR1 and PIR2 are required for tolerance to heat shock. Yeast 9(5):481-94
Russo P, et al.  (1992) A heat shock gene from Saccharomyces cerevisiae encoding a secretory glycoprotein. Proc Natl Acad Sci U S A 89(9):3671-5